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Re Opening of Request for Empanelment

by Department of Electronics and Information Technology(DeitY)

  1. Published

    Mon, 10 Aug

    6:00 pm

  2. Bid submission closes

    Mon, 5 Oct

    4:00 pm· 7 days left

  3. Bid opening

    Tue, 6 Oct

    5:00 pm

DocumentsBid on portal

Fees, EMD and value

Tender value
Not stated
See tender documents
EMD
Nil
Tender fee
No fee
Work location
NeGD, New Delhi
PIN 110003
Bid validity
180 days

Tender details

Organisation
Department of Electronics and Information Technology(DeitY) › National e-Governance Division MCIT
Location
Central Government
Tender ID
2026_DIT_920971_1
Reference no.
NeGD_AI_RFE_02
Category
Other
Work description
Re Opening of Request for Empanelment of Partner Agencies for Deployment of AI/ML Resources
Tender type
Open Tender
Tender category
Services · Miscellaneous Services
Form of contract
Empanelment
Fee and EMD payment
Not Applicable
Source portal
Central Govt eProcurement (NIC)

Tender documents and BOQ

Notice inviting tender (NIT)

  • RFE

    Tendernotice_1.pdf

    6.4 MB

Work item documents

  • Re Opening of Request for Empanelment of Partner Agencies for Deployment of AI/ML Resources

    RFE.pdf

    6.9 MB

  • Cover 2

    FinAnnex.xls

    39 KB

Central Govt eProcurement (NIC) requires a security check (CAPTCHA) before each download, so the files themselves open there. Search for Tender ID 2026_DIT_920971_1.

Download on portal

Important dates

  1. Published

    10 Aug 2026, 6:00 pm

  2. Documents available from

    10 Aug 2026, 6:05 pm

  3. Bid submission opens

    18 Aug 2026, 5:00 pm

  4. Documents available untilNext

    5 Oct 2026, 4:00 pm

  5. Bid submission closes

    5 Oct 2026, 4:00 pm

  6. Bid opening

    6 Oct 2026, 5:00 pm

Tender inviting authority

Aditi Singh

4th Floor, 6, CGO Complex, Pragati Vihar, New Delhi, Delhi 110003

How to bid

  1. 1Check the fees, EMD, dates and document list on this page to decide whether to bid.
  2. 2Download the tender documents and BOQ from Central Govt eProcurement (NIC) (search for Tender ID 2026_DIT_920971_1), along with any corrigenda.
  3. 3Register on the portal as a bidder with a Class 3 Digital Signature Certificate (DSC), then upload your bid before the closing time.
Everything published on the portalCovers, payment instruments, fee and EMD details, work item details and more

Basic Details

Organisation Chain
Department of Electronics and Information Technology(DeitY)||National e-Governance Division MCIT
Tender Reference Number
NeGD_AI_RFE_02
Tender ID
2026_DIT_920971_1
Withdrawal Allowed
Yes
Tender Type
Open Tender
Form Of Contract
Empanelment
Tender Category
Services
No. of Covers
2
General Technical Evaluation Allowed
No
ItemWise Technical Evaluation Allowed
No
Payment Mode
Not Applicable
Is Multi Currency Allowed For BOQ
No
Is Multi Currency Allowed For Fee
No
Allow Two Stage Bidding
No

Covers InformationNo. Of Covers - 2

Cover NoCover TypeDescriptionDocument Type
1Fee/PreQual/TechnicalRe-empanelment.pdf
2FinanceFinancial.xls

Tender Fee DetailsTotal Fee in ₹ * - 0.00

Tender Fee in ₹
0.00
Tender Fee Exemption Allowed
No

EMD Fee Details

EMD Amount in ₹
0.00
EMD Exemption Allowed
No
EMD Fee Type
fixed

Work Item Details

Title
Re Opening of Request for Empanelment
Work Description
Re Opening of Request for Empanelment of Partner Agencies for Deployment of AI/ML Resources
NDA/Pre Qualification
Please refer Tender documents.
Product Category
Miscellaneous Services
Contract Type
Empanelment
Bid Validity(Days)
180
Location
NeGD, New Delhi
Pincode
110003
Bid Opening Place
Online NeGD
Should Allow NDA Tender
No
Allow Preferential Bidder
No
Allow FTA Bidder
No
Tenderer Class
As per Tender Document

Critical Dates

Published Date
10-Aug-2026 06:00 PM
Bid Opening Date
06-Oct-2026 05:00 PM
Document Download / Sale Start Date
10-Aug-2026 06:05 PM
Document Download / Sale End Date
05-Oct-2026 04:00 PM
Bid Submission Start Date
18-Aug-2026 05:00 PM
Bid Submission End Date
05-Oct-2026 04:00 PM

Collected from Central Govt eProcurement (NIC) on 28 Sept 2026, 12:48 am IST.

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