Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging

by Department of Defence Research and Development

Published
Thu, 1 Oct
5:10 pm
Bid submission closes
Thu, 15 Oct
2:00 pm· 13 days left
Bid opening
Fri, 16 Oct
2:30 pm

Tender details

Organisation: Department of Defence Research and Development
Location: Central Government
Tender ID: 2026_DRDO_792120_1
Reference no.: SSPL/MMG/DPP/SBM/B/R/26-27/094
Category: Machinery & Equipment
Source portal: CPPP — Central Public Procurement Portal

How to bid

1To find the tender, search CPPP — Central Public Procurement Portal for Tender ID 2026_DRDO_792120_1.
2Download the tender documents and any corrigenda. Check eligibility, EMD and the document fee.
3Register on the portal as a bidder with a Class 3 Digital Signature Certificate (DSC), then upload your bid before the closing time.

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Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging

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