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Die Bonder and Wedge and Ball Bonder

by Department of Higher Education

  1. EMD

    ₹1.7 lakh

    ₹1,68,000

  2. Published

    Tue, 29 Sept

    6:25 pm

  3. Bid submission closes

    Tue, 20 Oct

    7:00 pm· 16 days left

Key terms of this bid

Read from the GeM bid document on 30 Sept 2026, 6:24 am IST. The document below is the final word.

EMD
₹1,68,000
1.68 lakh
Performance security
5% ePBG
For 26 months
Bid type
Two Packet
Total value wise evaluation
Reverse auction
Yes
After technical evaluation
Offer validity
180 days
From the bid end date
Experience & turnover relaxation
No
Purchase preference
MSE + Make in India

Delivery location

  • IIT Gandhinagar, Academic Block-3, Palaj, Gandhinagar

    PIN 382355 · Quantity 1 · Deliver within 98 days

Tender details

Organisation
Ministry of Education › Department of Higher Education
Tender ID
GEM/2026/B/8097318
Category
Other
Quantity
1
Source portal
GeM — Government e-Marketplace

Bid document

GeM bid document · GEM/2026/B/8097318

Official PDF: terms, eligibility, EMD, specifications and ATC

Open Download

How to bid

  1. 1Read the bid document on this page: the terms, eligibility, EMD, specifications and ATC (additional terms and conditions).
  2. 2Log in to your GeM seller account (register at gem.gov.in if you don't have one; it's free).
  3. 3Search BidPlus for bid number GEM/2026/B/8097318 and submit your offer before the closing time.

New to bidding? Read How to participate in a GeM bid, step by step: from finding the bid to getting paid, How to read a GeM bid document, section by section and GeM seller registration: documents, charges and steps.

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